Intloko yeSkena yeLaser Galvo ye-3D G3-3D Series
Intloko yokuSkena yeGalvanometer echanekileyo kakhulu kunye nesantya esiphezulu yokuMakisha iLaser, ukuWelda, ukusika ...
Inkqubo yokuskena i-G3 3D laser galvo yenzelwe ukuchaneka okuphezulu kunye noluhlu lokutshintsha ukugxila okuphezulu, ukudibanisa ukufunyanwa kwedatha, ukucutshungulwa kwedatha, ulawulo lwe-elektroniki, ukulandela oomatshini, ukuthathwa kwemifanekiso ebonakalayo, imbuyekezo ye-optical, ukuskena okubonakalayo, kunye neminye imisebenzi. I-G3 3D isebenzisa imodyuli ye-axis yokutshintsha ukugxila eyenziwe yi-JCZ, enempendulo ekhawulezayo, ukutshintshwa kokugxila okukhawulezayo nokuzinzileyo. Isebenzisa iindlela ezahlukeneyo zokulwa nokuphazamiseka, inamandla okulwa nokuphazamiseka, ukuthembeka okuphezulu, ulungelelwano oluhle, ukuchaneka kokuphindaphinda okuphezulu, kunye nexesha elifutshane lokuphendula. I-G3 3D isebenzisa isakhiwo esidibeneyo, ubungakanani obuncinci, ukhaphukhaphu, kunye nokuvalwa okuhle ukuqinisekisa uzinzo phantsi kwemeko yokusebenza ixesha elide.
Isoftware ye-Ezcad3 kunye nesilawuli se-DLC, esetyenziswa ne-G3 3D galvo scanner isebenzisa i-algorithm ephucukileyo yokulandelela i-point-by-point dynamic laser beam compensation. Yonke inkqubo inokufikelela kwindawo encinci yokugxila, intsimi ebanzi yokuskena, kunye nokuguquguquka okuphezulu.
Inkqubo yokuskena ye-G3 3D ifanelekile ekucutshungulweni komphezulu okuntsonkothileyo, ukukrola okunzulu kwe-3D, ukusika ngamandla aphezulu, ukubhola, ukwenziwa kwe-laser microfabrication, usetyenziso lwe-3D, i-laser rapid prototyping, njl. Ngokugqunywa kwesipili okufanelekileyo kunye nelensi ye-F-theta, inokucubungula izinto ezahlukeneyo ezifana nesinyithi, isikhumba, irabha, umthi, iimveliso ze-bamboo, iithayile, iplastiki, imabula, i-jade, njl.
Imifanekiso yeSampuli
Iinkcukacha
| Iskena | Isantya sokumakisha | 4000mm/s | Isantya sokuBeka | 10000mm/s |
| Impazamo yokulandelela | 0.25ms | Ukungangqamani | <3.5mrad/ 44° | |
| Isikali esipheleleyo se-1% | ≤0.4ms | Ukuphucula Uhambo | <50PPM/K | |
| Ukuqhuba ngaphandle kwe-Offset | <15μrad/k | Qhuba ngaphezulu kweeyure ezisi-8 | <0.3mrad | |
| I-engile yokuSkena | ±0.35rad | Imbobo yesipili | 10mm | |
| Isiseko | Ujongano | XY2-100 | Ubushushu bokusebenza | 25℃±10℃ |
| Amandla | ±15VDC,3A | I-Wavelenght | 1064nm/ 532nm/ 355nm | |
| I-Z AXIS | Imbobo yokufaka | 7mm/ 3mm | Umlinganiselo womqadi | 1.4/3 |
| Uluhlu lokugxila | ±30mm | Indawo yokuMakisha | 150mm (Ilensi ye-F-theta enokutshintshwa) |
Ubungakanani beMveliso













