MT350 Series | Laser Trimming Machine for Precision Wafer Processing
MT350 Series Laser Trimming Machine – Precision Solutions for Wafer Processing
The MT350 Series Laser Trimming Machine is engineered for precision in semiconductor wafer processing. Compatible with 4-inch, 6-inch, and 8-inch wafers, it features advanced visual identification and positioning for full wafer preview and arbitrary positioning. Key capabilities include:
Data Collection and Yield Statistics: Provides insights into production efficiency and quality.
Defective Product Marking: Easily identifies and marks defects for better quality control.
Automatic Wafer Handling: Streamlines loading and unloading processes for increased efficiency.
Ultra-High Precision: Utilizes high-speed scanning galvanometers and precision modules, achieving trimming accuracy of <±0.3%.
355 nm Laser Source: Customizable with other laser types to suit specific needs.
GBIP Expansion Interface: Allows connection to external measurement devices for enhanced functionality.
Optimize your semiconductor production with the MT350 series, designed for high accuracy and efficiency in wafer trimming applications.
Specifications
| Laser Wavelength: 355 nm |
| Minimum Spot Size: 5 μm |
| Galvanometer Scanning Speed: 0-8000 mm/s |
| Galvanometer Repeatability: ±1 μm |
| Motion mechanism |
| XY module repeat positioning accuracy <±1μm |
| Rotary table repeat positioning accuracy 士2.5" |
| Lifting platform repeat positioning accuracy <±1μm |
| Wafer-specific automatic loading and unloading mechanism |
| Measurement system |
| Resistance adjustment range: 10Ω–1MΩ |
| Resistance adjustment accuracy: <±0.3% |
| Standard configuration: 24 measurement channels |
| Power requirements |
| Equipment power supply: 220V, 50Hz (single-phase) |
| Air supply pressure: 0.4–0.6 Mpa |
| Ambient temperature: 24±4°C; air-conditioned constant temperature |
